| Type | Description |
| Part Status | Active |
|---|---|
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Melting Point | 423°F (217°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Process | Lead Free |
| Form | Jar, 21.16 oz (600g) |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | - |
| RoHS Status | RoHS Compliant |
|---|---|
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Lifecycle Status | Obsolete / End of life |
| Stock Category | Available stock |
