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Solder Stencils, Templates

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PA0082-S
Chip Quik Inc.

PA0082-S

part stock: 6345

Type: SOT/SC, Number of Positions: 3, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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PA0052-S
Chip Quik Inc.

PA0052-S

part stock: 6397

Type: MLP/MLF, Number of Positions: 14, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm), Thermal Center Pad: 0.087" L x 0.276" W (2.20mm x 7.00mm),

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IPC0127-S
Chip Quik Inc.

IPC0127-S

part stock: 6360

Type: DFN, Number of Positions: 12, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.098" L x 0.157" W (2.50mm x 4.00mm), Thermal Center Pad: 0.077" L x 0.096" W (1.95mm x 2.45mm),

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PA0055-S
Chip Quik Inc.

PA0055-S

part stock: 6391

Type: MLP/MLF, Number of Positions: 28, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm),

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IPC0015-S
Chip Quik Inc.

IPC0015-S

part stock: 6322

Type: QFN/LFCSP, Number of Positions: 24, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm), Thermal Center Pad: 0.150" L x 0.150" W (3.80mm x 3.80mm),

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IPC0162-S
Chip Quik Inc.

IPC0162-S

part stock: 26

Type: SSOP, Number of Positions: 24, Pitch: 0.039" (1.00mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.512" L x 0.236" W (13.00mm x 6.00mm),

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FPC050P060-S
Chip Quik Inc.

FPC050P060-S

part stock: 6403

Type: FPC/FFC, Number of Positions: 60, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm), Thermal Center Pad: 0.157" L x 1.488" W (4.00mm x 37.80mm),

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IPC0126-S
Chip Quik Inc.

IPC0126-S

part stock: 6400

Type: QFN/LFCSP, Number of Positions: 20, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.177" L x 0.138" W (4.50mm x 3.50mm), Thermal Center Pad: 0.081" L x 0.120" W (2.05mm x 3.05mm),

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IPC0055-S
Chip Quik Inc.

IPC0055-S

part stock: 6382

Type: DFN, Number of Positions: 6, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm), Thermal Center Pad: 0.018" L x 0.039" W (0.45mm x 1.00mm),

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PA0229-S
Chip Quik Inc.

PA0229-S

part stock: 6356

Type: TSOP, Number of Positions: 56, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm),

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PA0045-S
Chip Quik Inc.

PA0045-S

part stock: 6336

Type: VSOP, Number of Positions: 16, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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PA0065-S
Chip Quik Inc.

PA0065-S

part stock: 6392

Type: QFN/LFCSP, Number of Positions: 28, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm),

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PA0022-S
Chip Quik Inc.

PA0022-S

part stock: 6400

Type: SSOP, Number of Positions: 36, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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IPC0171-S
Chip Quik Inc.

IPC0171-S

part stock: 5720

Type: BGA, Number of Positions: 25, Pitch: 0.039" (1.00mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.315" L x 0.236" W (8.00mm x 6.00mm),

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IPC0107-S
Chip Quik Inc.

IPC0107-S

part stock: 6409

Type: QFN/LFCSP, Number of Positions: 24, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm), Thermal Center Pad: 0.087" L x 0.087" W (2.20mm x 2.20mm),

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PA0121-S
Chip Quik Inc.

PA0121-S

part stock: 5678

Type: LQFP, Number of Positions: 128, Pitch: 0.020" (0.50mm), Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm), Inner Dimension: 0.551" L x 0.787" W (14.00mm x 20.00mm),

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FPC040P060-S
Chip Quik Inc.

FPC040P060-S

part stock: 6336

Type: FPC/FFC, Number of Positions: 60, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Thermal Center Pad: 0.157" L x 1.173" W (4.00mm x 29.80mm),

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PA0188-S
Chip Quik Inc.

PA0188-S

part stock: 6145

Type: TQFP, Number of Positions: 144, Pitch: 0.020" (0.50mm), Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm), Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm),

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IPC0020-S
Chip Quik Inc.

IPC0020-S

part stock: 6194

Type: QFN/LFCSP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm), Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm),

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IPC0046-S
Chip Quik Inc.

IPC0046-S

part stock: 6359

Type: QFN/LFCSP, Number of Positions: 68, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm), Thermal Center Pad: 0.193" L x 0.193" W (4.90mm x 4.90mm),

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IPC0183-S
Chip Quik Inc.

IPC0183-S

part stock: 5678

Type: PowerSOIC, Number of Positions: 20, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Thermal Center Pad: 0.130" L x 0.154" W (3.30mm x 3.90mm),

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IPC0175-S
Chip Quik Inc.

IPC0175-S

part stock: 5756

Type: QFN/LFCSP, Number of Positions: 20, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm), Thermal Center Pad: 0.081" L x 0.100" W (2.05mm x 2.55mm),

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PA0228-S
Chip Quik Inc.

PA0228-S

part stock: 6396

Type: TSOP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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IPC0105-S
Chip Quik Inc.

IPC0105-S

part stock: 6325

Type: LGA, Number of Positions: 28, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.197" W (4.00mm x 5.00mm),

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FPC100P040-S
Chip Quik Inc.

FPC100P040-S

part stock: 6343

Type: FPC/FFC, Number of Positions: 40, Pitch: 0.039" (1.00mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm), Thermal Center Pad: 0.157" L x 1.955" W (4.00mm x 49.65mm),

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PA0150-S
Chip Quik Inc.

PA0150-S

part stock: 6394

Type: LLP, Number of Positions: 64, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm),

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PA0036-S
Chip Quik Inc.

PA0036-S

part stock: 6329

Type: TSSOP, Number of Positions: 24, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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IPC0115-S
Chip Quik Inc.

IPC0115-S

part stock: 6379

Type: DFN, Number of Positions: 14, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm), Thermal Center Pad: 0.142" L x 0.169" W (3.60mm x 4.30mm),

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PA0201-S
Chip Quik Inc.

PA0201-S

part stock: 5721

Type: PQFP, Number of Positions: 160, Pitch: 0.026" (0.65mm), Outer Dimension: 1.800" L x 2.600" W (45.72mm x 66.04mm), Inner Dimension: 1.102" L x 1.102" W (28.00mm x 28.00mm),

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IPC0172-S
Chip Quik Inc.

IPC0172-S

part stock: 5749

Type: DFN, Number of Positions: 8, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.236" L x 0.315" W (6.00mm x 8.00mm), Thermal Center Pad: 0.134" L x 0.169" W (3.40mm x 4.30mm),

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PA0105-S
Chip Quik Inc.

PA0105-S

part stock: 6358

Type: PLCC/JLCC, Number of Positions: 20, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm),

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PA0225-S
Chip Quik Inc.

PA0225-S

part stock: 6367

Type: LSOP, Number of Positions: 10, Pitch: 0.063" (1.60mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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PA0145-S
Chip Quik Inc.

PA0145-S

part stock: 6328

Type: LLP, Number of Positions: 44, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm),

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IPC0190-S
Chip Quik Inc.

IPC0190-S

part stock: 5664

Type: RN, Number of Positions: 24, Pitch: 0.047" (1.20mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm),

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IPC0149-S
Chip Quik Inc.

IPC0149-S

part stock: 6321

Type: SSOP, Number of Positions: 32, Pitch: 0.025" (0.64mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm),

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FPC080P040-S
Chip Quik Inc.

FPC080P040-S

part stock: 6324

Type: FPC/FFC, Number of Positions: 40, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm), Thermal Center Pad: 0.157" L x 1.563" W (4.00mm x 39.70mm),

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