Type: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Melting Point: 441°F (227°C), Flux Type: No-Clean, Water Soluble,
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: Water Soluble,
Type: Wire Solder, Composition: Sn60Pb40 (60/40), Diameter: 0.020" (0.51mm), Melting Point: 361 ~ 370°F (183 ~ 188°C), Flux Type: No-Clean, Water Soluble,
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean, Wire Gauge: 20 AWG, 22 SWG,
Type: Wire Solder, Composition: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Melting Point: 361°F (183°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,
Type: Solder Paste, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Melting Point: 281°F (138°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean,
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.008" (0.20mm), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 32 AWG, 35 SWG,
Type: Wire Solder, Composition: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Melting Point: 354°F (179°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean, Water Soluble,
Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.025" (0.64mm), Melting Point: 423 ~ 428°F (217 ~ 220°C),
Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.010" (0.25mm), Melting Point: 423 ~ 428°F (217 ~ 220°C),
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: Water Soluble,
Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.030" (0.76mm), Melting Point: 423 ~ 428°F (217 ~ 220°C),
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: No-Clean,
Type: Wire Solder, Composition: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Melting Point: 354°F (179°C), Flux Type: No-Clean, Water Soluble,
Type: Wire Solder, Composition: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Melting Point: 361°F (183°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Type: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Melting Point: 441°F (227°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 27 AWG, 28 SWG,
Type: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Melting Point: 441°F (227°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,
Type: Solder Sphere, Composition: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Melting Point: 361°F (183°C),
Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Melting Point: 423 ~ 428°F (217 ~ 220°C),
Type: Solder Sphere, Composition: Sn63Pb37 (63/37), Diameter: 0.008" (0.20mm), Melting Point: 361°F (183°C),
