Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Type: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Melting Point: 441°F (227°C), Flux Type: No-Clean, Water Soluble,
Type: Wire Solder, Composition: In52Sn48 (52/48), Diameter: 0.031" (0.79mm), Melting Point: 244°F (118°C), Wire Gauge: 20 AWG, 21 SWG,
Type: Wire Solder, Composition: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Melting Point: 354°F (179°C), Flux Type: No-Clean, Water Soluble,
Type: Solder Sphere, Composition: Sn63Pb37 (63/37), Diameter: 0.014" (0.36mm), Melting Point: 361°F (183°C),
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean,
Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.030" (0.76mm), Melting Point: 423 ~ 428°F (217 ~ 220°C),
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,
Type: Solder Sphere, Composition: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Melting Point: 361°F (183°C),
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: Water Soluble,
Type: Solder Paste, Two Part Mix, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Melting Point: 281°F (138°C), Flux Type: No-Clean,
Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.014" (0.36mm), Melting Point: 423 ~ 428°F (217 ~ 220°C),
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 428°F (217 ~ 220°C), Flux Type: Water Soluble,
Type: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Melting Point: 441°F (227°C), Flux Type: No-Clean, Water Soluble,
Type: Solder Paste, Composition: Sn96.5Ag3.5 (96.5/3.5), Melting Point: 430°F (221°C), Flux Type: Water Soluble,
Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.012" (0.31mm), Melting Point: 423 ~ 428°F (217 ~ 220°C),
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: No-Clean,
