Sockets for ICs, Transistors

251-5949-02-0602

part stock: 930

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

252-4205-00

part stock: 76

232-5205-01

part stock: 938

Type: QFN, Number of Positions or Pins (Grid): 32 (4 x 8), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

228-5204-01

part stock: 1041

Type: QFN, Number of Positions or Pins (Grid): 28 (4 x 7), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

200-6319-9UN-1900

part stock: 999

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 361 (19 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

224-5205-01

part stock: 987

Type: QFN, Number of Positions or Pins (Grid): 24 (4 x 6), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

248-5205-00

part stock: 1008

Type: QFN, Number of Positions or Pins (Grid): 48 (4 x 12), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

216-5205-01

part stock: 1102

Type: QFN, Number of Positions or Pins (Grid): 16 (4 x 4), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

251-5949-51-0602

part stock: 1053

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

251-5949-52-0602

part stock: 1008

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

200-6315-9UN-1900

part stock: 1089

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 225 (15 x 15), Pitch - Mating: 0.100" (2.54mm),

240-5205-00

part stock: 1083

Type: QFN, Number of Positions or Pins (Grid): 40 (4 x 10), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

235-3019-02-0602

part stock: 1162

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

235-3019-01-0602

part stock: 1146

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

234-3034-02-0602

part stock: 1268

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

234-3034-01-0602

part stock: 1201

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

235-3019-52-0602

part stock: 1240

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

235-3019-51-0602

part stock: 1196

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

234-3034-52-0602

part stock: 1267

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

234-3034-51-0602

part stock: 1292

Type: Zig-Zag, ZIF (ZIP), Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

200-6317-9UN-1900

part stock: 1334

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 289 (17 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

264-9381-90-2401

part stock: 75

290-1294-00-3302J

part stock: 1722

Type: DIP, ZIF (ZIP), Number of Positions or Pins (Grid): 90 (2 x 45), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

200-6313-9UN-1900

part stock: 1719

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 169 (13 x 13), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

232-2601-00-0602

part stock: 1683

Type: SIP, ZIF (ZIP), Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

200-6310-9UN-1900

part stock: 1761

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 100 (10 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

264-4493-00-0602J

part stock: 1685

Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

236-6225-00-0602

part stock: 1699

Type: SIP, ZIF (ZIP), Number of Positions or Pins (Grid): 36 (1 x 36), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

200-6311-9UN-1900

part stock: 1687

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 121 (11 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

224-5809-00-0602

part stock: 1915

Type: SIP, ZIF (ZIP), Number of Positions or Pins (Grid): 24 (1 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

228-7474-55-1902

part stock: 1859

Type: SOIC, Number of Positions or Pins (Grid): 28 (2 x 14), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

239-5605-02-0602

part stock: 1848

Type: Zig-Zag, Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

232-2601-50-0602

part stock: 1947

239-5605-01-0602

part stock: 1959

Type: Zig-Zag, Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

224-5809-50-0602

part stock: 86

236-6225-50-0602

part stock: 1876