Type: DIP, .300", Number of Positions or Pins (Grid): 28 (2 x 14), Contact Material: Copper Alloy,
Type: LCC, .050", Number of Positions or Pins (Grid): 20 (4 x 5), Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 16 (2 x 8), Contact Material: Copper Alloy,
Type: DIP with Cable Assembly, Number of Positions or Pins (Grid): 16 (2 x 8), Contact Material: Nickel Silver,
Type: DIP, .900", Number of Positions or Pins (Grid): 64 (2 x 32), Contact Material: Copper Alloy,
Type: DIP, 0.5 to 0.6" Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 36 (2 x 18), Contact Material: Copper Alloy,
Type: DIP with Cable Assembly, Number of Positions or Pins (Grid): 40 (2 x 20), Contact Material: Nickel Silver,
Type: PLCC, .050", Number of Positions or Pins (Grid): 20 (4 x 5), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: SOIC, 0.30" Body, Number of Positions or Pins (Grid): 18 (2 x 9), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: PLCC, .050", Number of Positions or Pins (Grid): 68 (4 x 17), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, 0.5 to 0.6" Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 36 (2 x 18), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 18 (2 x 9), Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 48 (2 x 24), Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 22 (2 x 11), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 22 (2 x 11), Contact Material: Copper Alloy,
Type: PLCC, .050", Number of Positions or Pins (Grid): 44 (4 x 11), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 40 (2 x 20), Contact Material: Copper Alloy,
Type: DIP, .900", Number of Positions or Pins (Grid): 64 (2 x 32), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 28 (2 x 14), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 24 (2 x 12), Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 20 (2 x 10), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: SOIC, 0.30" Body, Number of Positions or Pins (Grid): 28 (2 x 14), Contact Material: Copper Alloy,
Type: PLCC, .050", Number of Positions or Pins (Grid): 28 (4 x 7), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 40 (2 x 20), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .600", Number of Positions or Pins (Grid): 28 (2 x 14), Contact Material: Copper Alloy,
Type: DIP, 0.3" Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: SOIC, 0.15" Body, Number of Positions or Pins (Grid): 16 (2 x 8), Contact Material: Copper Alloy,
Type: SOIC, 0.30" Body, Number of Positions or Pins (Grid): 24 (2 x 12), Contact Material: Copper Alloy,
Type: DIP, 0.3" Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 16 (2 x 8), Contact Material: Copper Alloy,
Type: PLCC, .050", Number of Positions or Pins (Grid): 52 (4 x 13), Contact Finish: Gold, Contact Material: Copper Alloy,
