Sockets for ICs, Transistors

123-41-642-41-001000

part stock: 31

110-43-314-41-105000

part stock: 749

110-93-314-41-105000

part stock: 4651

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

115-93-952-41-001000

part stock: 4595

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

115-43-952-41-001000

part stock: 92

116-43-952-41-003000

part stock: 72

116-91-650-41-006000

part stock: 94

116-41-950-41-006000

part stock: 66

116-91-950-41-006000

part stock: 38

116-93-952-41-003000

part stock: 4600

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-41-650-41-006000

part stock: 65

126-93-318-41-003000

part stock: 4617

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-318-41-003000

part stock: 41

104-11-640-41-770000

part stock: 92

126-93-428-41-003000

part stock: 4601

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-328-41-003000

part stock: 85

104-11-650-41-780000

part stock: 114

126-43-428-41-003000

part stock: 43

126-93-328-41-003000

part stock: 4655

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-628-41-003000

part stock: 107

123-11-424-41-001000

part stock: 41

123-11-324-41-001000

part stock: 107

126-93-628-41-003000

part stock: 4577

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

121-13-640-41-001000

part stock: 4630

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-11-624-41-001000

part stock: 74

116-41-642-41-007000

part stock: 31

116-91-642-41-007000

part stock: 113

1437535-6

part stock: 3463

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

1437538-2

part stock: 3539

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy,

1437532-5

part stock: 3522

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm),

1437508-6

part stock: 3456

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 8 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

1437504-3

part stock: 3484

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 4 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

1-390262-1

part stock: 8346

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

1-822473-2

part stock: 3474

Type: PLCC, Number of Positions or Pins (Grid): 28 (4 x 7), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 80.0µin (2.03µm), Contact Material - Mating: Phosphor Bronze,

1-390261-1

part stock: 3491

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze,

1-345830-1

part stock: 3471

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm),