Sockets for ICs, Transistors

122-13-648-41-001000

122-13-648-41-001000

part stock: 4062

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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126-93-952-41-001000

126-93-952-41-001000

part stock: 4045

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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126-93-652-41-001000

126-93-652-41-001000

part stock: 4050

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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123-93-952-41-001000

123-93-952-41-001000

part stock: 4047

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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116-93-964-41-007000

116-93-964-41-007000

part stock: 4042

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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126-93-640-41-003000

126-93-640-41-003000

part stock: 4067

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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1640258-9

1640258-9

part stock: 5112

Type: PGA, Number of Positions or Pins (Grid): 576 (24 x 24), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold,

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1825532-4

1825532-4

part stock: 5103

Type: SIP, Number of Positions or Pins (Grid): 10 (1 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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105028-2011

105028-2011

part stock: 5226

Type: Camera Socket, Number of Positions or Pins (Grid): 32 (4 x 8), Pitch - Mating: 0.035" (0.90mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 12.0µin (0.30µm), Contact Material - Mating: Copper Alloy,

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