Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: Rosin Mildly Activated (RMA),
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 424°F (217 ~ 218°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 424°F (217 ~ 218°C), Flux Type: Water Soluble,
Type: Solder Paste, Composition: Sn62Pb36Ag2 (62/36/2), Melting Point: 354°F (179°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: Water Soluble,
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn62Pb36Ag2 (62/36/2), Melting Point: 354°F (179°C), Flux Type: Water Soluble,
Type: Solder Paste, Composition: Sn99.3Cu0.7 (99.3/0.7), Melting Point: 441°F (227°C), Flux Type: No-Clean,