Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 424°F (217 ~ 218°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: Water Soluble,
Type: Solder Paste, Composition: Sn95Sb5 (95/5), Melting Point: 450 ~ 464°F (232 ~ 240°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn96.3Ag3.7 (96.3/3.7), Melting Point: 430 ~ 444°F (221 ~ 223°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423 ~ 424°F (217 ~ 218°C), Flux Type: Water Soluble,
Type: Solder Paste, Composition: Sn99Cu0.7Ag0.3 (99/0.7/0.3), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn62Pb36Ag2 (62/36/2), Melting Point: 354°F (179°C), Flux Type: Water Soluble,
Type: Solder Paste, Composition: Sn62Pb36Ag2 (62/36/2), Melting Point: 354°F (179°C), Flux Type: No-Clean,
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Melting Point: 423°F (217°C), Flux Type: No-Clean, Wire Gauge: 14 AWG, 16 SWG,
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Melting Point: 423°F (217°C), Flux Type: Water Soluble, Wire Gauge: 14 AWG, 16 SWG,
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Melting Point: 423°F (217°C), Flux Type: No-Clean, Wire Gauge: 27 AWG, 28 SWG,
Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Melting Point: 423°F (217°C), Flux Type: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,
