Sockets for ICs, Transistors

1825093-1

part stock: 3084

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Phosphor Bronze,

1-1825093-1

part stock: 3144

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

1-822473-4

part stock: 3087

Type: PLCC, Number of Positions or Pins (Grid): 44 (4 x 11), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

1-390261-9

part stock: 3169

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze,

1825093-2

part stock: 3019

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Phosphor Bronze,

1-1571551-0

part stock: 5578

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

1-916783-5

part stock: 2353

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 370 (19 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Phosphor Bronze,

1-1981837-2

part stock: 4872

Type: LGA, Number of Positions or Pins (Grid): 1366 (32 x 41), Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Copper Alloy,

1-1437531-5

part stock: 4986

1761503-1

part stock: 5427

Type: PGA, Number of Positions or Pins (Grid): 940 (30 x 30), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm),

1825088-2

part stock: 5608

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 12 (2 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper,

1-1437532-5

part stock: 5556

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold,

1-1747890-2

part stock: 3275

Type: LGA, Number of Positions or Pins (Grid): 771 (33 x 33), Pitch - Mating: 0.043" (1.09mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Copper Alloy,

1-1814655-3

part stock: 9702

Type: SIP, Number of Positions or Pins (Grid): 20 (1 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

1-822473-7

part stock: 8022

Type: PLCC, Number of Positions or Pins (Grid): 84 (4 x 21), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Phosphor Bronze,

1814654-3

part stock: 9686

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

1814640-2

part stock: 9713

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Beryllium Copper,

1825108-1

part stock: 9676

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Phosphor Bronze,

1437542-6

part stock: 9639

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper,

1-1437504-1

part stock: 9602

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 4 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

1-390262-2

part stock: 9600

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

1-1825094-7

part stock: 9633

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

1-1437508-3

part stock: 6511

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 8 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

1-2013620-1

part stock: 6508

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

1437532-7

part stock: 6709

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm),

1-1437504-8

part stock: 9197

1-1571550-0

part stock: 9389

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

1-1571550-2

part stock: 10810

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

1-1571586-0

part stock: 11764

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

1-1437504-6

part stock: 10638

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 3 (Round), Contact Finish - Mating: Gold,

1-1437538-3

part stock: 10448

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Material - Mating: Copper Alloy,

1-1437508-7

part stock: 7864

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 8 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

1825088-3

part stock: 12745

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper,

1571550-8

part stock: 14342

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

1825415-1

part stock: 12471

1-1437540-4

part stock: 14901

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy,