Sockets for ICs, Transistors

APA-314-T-K

part stock: 33304

APA-422-T-J

part stock: 33323

APA-316-T-A

part stock: 33442

APA-316-T-A1

part stock: 34630

APA-320-T-J

part stock: 36620

APA-308-T-P

part stock: 37404

APA-308-G-J

part stock: 37825

APA-308-T-B

part stock: 38026

APA-314-T-A

part stock: 38382

APA-314-T-A1

part stock: 39646

APA-318-T-J

part stock: 40746

APA-308-T-N

part stock: 44453

APA-308-T-D

part stock: 44979

APA-316-T-J

part stock: 45844

APA-308-T-M

part stock: 49907

APA-308-T-C

part stock: 50579

APA-314-T-J

part stock: 52404

APA-308-T-K

part stock: 54258

APA-308-T-A

part stock: 62646

APA-308-T-A1

part stock: 64282

APA-308-T-J

part stock: 85179

IC-316-SGG

part stock: 4846

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

ICO-314-CTT

part stock: 38221

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

ICO-314-SST

part stock: 42101

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

ICF-308-S-O

part stock: 29000

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

ICA-628-STT

part stock: 35235

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

PLCC-044-T-N

part stock: 21701

Type: PLCC, Number of Positions or Pins (Grid): 44 (4 x 11), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

ICO-314-SST-L

part stock: 30578

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

ICA-316-STT

part stock: 57211

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

MHAS-181-ZMGG-15

part stock: 2136

Type: BGA, Number of Positions or Pins (Grid): 181 (15 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold,

ICA-324-STT

part stock: 40964

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

ICO-628-CGT

part stock: 11606

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

ICF-628-T-O-TR

part stock: 1657

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

ICO-628-MGT

part stock: 13879

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

ICO-318-SGT

part stock: 28332

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

IC-316-SGT

part stock: 4882

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,