Type: PLCC, Number of Positions or Pins (Grid): 84 (4 x 21), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,
Type: PGA, Number of Positions or Pins (Grid): 145 (15 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 144 (15 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 144 (12 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 191 (18 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 181 (15 x 15), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 144 (13 x 13), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 300 (21 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 299 (20 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 179 (18 x 18), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 324 (18 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 178 (18 x 18), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 305 (18 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 304 (14 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 169 (17 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 192 (14 x 14), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 223 (18 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 289 (17 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 299 (16 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 124 (13 x 13), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 325 (18 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 296 (19 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 175 (16 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 149 (15 x 15), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 321 (19 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 321 (17 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 309 (21 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 293 (18 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,
Type: PGA, Number of Positions or Pins (Grid): 148 (15 x 15), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,
