Sockets for ICs, Transistors

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Sockets for ICs, Transistors

116-83-652-41-013101

116-83-652-41-013101

part stock: 6426

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-650-41-013101

116-83-650-41-013101

part stock: 6626

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-648-41-013101

116-83-648-41-013101

part stock: 6963

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-87-650-41-013101

116-87-650-41-013101

part stock: 7959

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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116-87-652-41-013101

116-87-652-41-013101

part stock: 8026

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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116-83-642-41-013101

116-83-642-41-013101

part stock: 8087

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-87-648-41-013101

116-87-648-41-013101

part stock: 8201

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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116-83-640-41-013101

116-83-640-41-013101

part stock: 8534

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-87-642-41-013101

116-87-642-41-013101

part stock: 9442

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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116-83-636-41-013101

116-83-636-41-013101

part stock: 9472

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-652-41-004101

116-83-652-41-004101

part stock: 9693

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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117-83-668-41-105101

117-83-668-41-105101

part stock: 9735

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 68 (2 x 34), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-87-640-41-013101

116-87-640-41-013101

part stock: 9898

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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116-83-650-41-004101

116-83-650-41-004101

part stock: 10025

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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117-83-664-41-105101

117-83-664-41-105101

part stock: 10339

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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117-83-764-41-105101

117-83-764-41-105101

part stock: 10414

Type: DIP, 0.75" (19.05mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-648-41-004101

116-83-648-41-004101

part stock: 10493

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-652-41-011101

116-83-652-41-011101

part stock: 10556

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-632-41-013101

116-83-632-41-013101

part stock: 10688

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-432-41-013101

116-83-432-41-013101

part stock: 10619

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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124-83-650-41-002101

124-83-650-41-002101

part stock: 10703

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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124-83-652-41-002101

124-83-652-41-002101

part stock: 10834

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-648-41-011101

116-83-648-41-011101

part stock: 10882

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-87-636-41-013101

116-87-636-41-013101

part stock: 10933

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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116-83-652-41-001101

116-83-652-41-001101

part stock: 11026

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-650-41-011101

116-83-650-41-011101

part stock: 11068

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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124-83-648-41-002101

124-83-648-41-002101

part stock: 11176

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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117-83-656-41-105101

117-83-656-41-105101

part stock: 11226

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 56 (2 x 28), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-87-652-41-004101

116-87-652-41-004101

part stock: 11261

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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116-83-650-41-001101

116-83-650-41-001101

part stock: 11411

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-628-41-013101

116-83-628-41-013101

part stock: 11523

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-428-41-013101

116-83-428-41-013101

part stock: 11554

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-328-41-013101

116-83-328-41-013101

part stock: 11530

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-83-642-41-004101

116-83-642-41-004101

part stock: 11682

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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116-87-432-41-013101

116-87-432-41-013101

part stock: 11683

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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116-87-632-41-013101

116-87-632-41-013101

part stock: 11719

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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2821

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