Sockets for ICs, Transistors

116-47-324-41-001000

part stock: 75

116-47-424-41-001000

part stock: 108

116-47-624-41-001000

part stock: 118

116-47-428-41-007000

part stock: 85

116-47-328-41-007000

part stock: 43

116-47-628-41-007000

part stock: 110

117-93-664-41-005000

part stock: 8979

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

117-93-764-41-005000

part stock: 9283

Type: DIP, 0.75" (19.05mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

117-43-764-41-005000

part stock: 8999

Type: DIP, 0.75" (19.05mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

114-47-652-41-117000

part stock: 66

116-47-432-41-006000

part stock: 52

116-47-632-41-006000

part stock: 97

110-93-640-41-801000

part stock: 9071

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-43-640-41-801000

part stock: 8966

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

124-43-304-41-002000

part stock: 71

124-93-304-41-002000

part stock: 9110

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-47-642-41-105000

part stock: 65

126-93-304-41-003000

part stock: 9228

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-304-41-003000

part stock: 38

114-47-650-41-117000

part stock: 71

116-47-322-41-001000

part stock: 117

116-47-422-41-001000

part stock: 90

123-13-640-41-001000

part stock: 9234

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

124-41-304-41-002000

part stock: 27

124-91-304-41-002000

part stock: 108

123-13-304-41-001000

part stock: 9367

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-91-304-41-003000

part stock: 84

126-41-304-41-003000

part stock: 85

110-47-640-41-105000

part stock: 68

117-47-640-41-005000

part stock: 115

116-93-304-41-001000

part stock: 9345

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-304-41-001000

part stock: 40

114-47-648-41-117000

part stock: 115

110-47-636-41-105000

part stock: 65

123-11-304-41-001000

part stock: 40

123-47-424-41-001000

part stock: 100