Sockets for ICs, Transistors

126-93-308-41-001000

part stock: 5687

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-41-210-41-001000

part stock: 122

115-44-328-41-003000

part stock: 83

115-44-628-41-003000

part stock: 68

115-91-636-41-001000

part stock: 115

115-41-636-41-001000

part stock: 92

126-93-308-41-003000

part stock: 5669

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-308-41-003000

part stock: 52

110-91-624-41-605000

part stock: 27

110-41-324-41-605000

part stock: 48

110-91-324-41-605000

part stock: 122

110-41-624-41-605000

part stock: 60

101-93-306-41-560000

part stock: 5708

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-43-322-41-001000

part stock: 43

110-93-322-41-001000

part stock: 4686

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-11-424-41-001000

part stock: 64

110-11-624-41-001000

part stock: 5732

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

110-11-324-41-001000

part stock: 74

104-11-310-41-780000

part stock: 54

122-11-210-41-001000

part stock: 111

115-41-422-41-003000

part stock: 56

114-41-322-41-117000

part stock: 114

114-91-422-41-117000

part stock: 98

114-91-322-41-117000

part stock: 108

114-41-422-41-117000

part stock: 57

110-13-316-10-003000

part stock: 5736

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), 8 Loaded, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-308-41-001000

part stock: 93

110-43-328-10-002000

part stock: 5761

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), 14 Loaded, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-93-308-41-001000

part stock: 5742

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-13-306-41-001000

part stock: 5756

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

121-13-210-41-001000

part stock: 5682

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

111-91-424-41-001000

part stock: 79

111-41-624-41-001000

part stock: 41

111-91-624-41-001000

part stock: 71

111-91-324-41-001000

part stock: 33

111-41-424-41-001000

part stock: 69