Sockets for ICs, Transistors

104-13-624-41-770000

part stock: 5021

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-13-424-41-770000

part stock: 5070

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-13-324-41-770000

part stock: 5018

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-41-628-41-008000

part stock: 39

116-91-328-41-008000

part stock: 80

116-41-328-41-008000

part stock: 78

116-41-428-41-008000

part stock: 36

116-91-628-41-008000

part stock: 105

116-91-428-41-008000

part stock: 116

116-93-322-41-001000

part stock: 5027

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-422-41-001000

part stock: 101

116-93-422-41-001000

part stock: 5035

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-322-41-001000

part stock: 28

104-11-428-41-770000

part stock: 113

104-11-628-41-770000

part stock: 51

110-13-432-41-001000

part stock: 5047

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

121-13-318-41-001000

part stock: 5082

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-11-328-41-770000

part stock: 72

116-91-432-41-003000

part stock: 115

116-41-432-41-003000

part stock: 56

111-93-308-61-001000

part stock: 111

116-41-632-41-003000

part stock: 52

116-91-632-41-003000

part stock: 100

111-43-308-61-001000

part stock: 95

115-91-950-41-001000

part stock: 94

115-41-950-41-001000

part stock: 98

123-11-316-41-001000

part stock: 80

104-13-322-41-780000

part stock: 5018

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-13-422-41-780000

part stock: 5014

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-44-316-61-001000

part stock: 124

110-13-306-61-001000

part stock: 94

110-99-316-61-001000

part stock: 87

115-93-308-61-003000

part stock: 63

126-93-320-41-001000

part stock: 5094

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-420-41-001000

part stock: 39

126-93-420-41-001000

part stock: 5048

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,