Sockets for ICs, Transistors

116-43-650-41-006000

part stock: 125

110-93-314-61-801000

part stock: 113

110-43-314-61-801000

part stock: 92

126-91-640-41-001000

part stock: 101

123-93-428-41-001000

part stock: 4832

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-43-428-41-001000

part stock: 58

126-41-640-41-001000

part stock: 37

117-91-652-41-005000

part stock: 58

117-41-652-41-005000

part stock: 74

110-13-636-41-001000

part stock: 4889

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-432-41-001000

part stock: 47

126-93-632-41-001000

part stock: 4896

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-632-41-001000

part stock: 96

126-93-432-41-001000

part stock: 4902

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

127-91-428-41-002000

part stock: 69

116-41-636-41-003000

part stock: 116

127-91-628-41-002000

part stock: 59

127-41-428-41-002000

part stock: 27

116-91-636-41-003000

part stock: 69

127-41-628-41-002000

part stock: 31

110-13-950-41-001000

part stock: 4894

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-41-322-41-002000

part stock: 43

126-91-322-41-002000

part stock: 100

110-13-322-41-801000

part stock: 4875

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-91-422-41-002000

part stock: 51

126-41-422-41-002000

part stock: 122

117-43-640-41-105000

part stock: 117

110-43-952-41-001000

part stock: 114

116-41-648-41-008000

part stock: 103

116-91-648-41-008000

part stock: 116

110-93-952-41-001000

part stock: 4848

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-628-41-007000

part stock: 29

116-43-328-41-007000

part stock: 38

116-93-628-41-007000

part stock: 4852

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-93-328-41-007000

part stock: 4914

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-93-428-41-007000

part stock: 4898

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,