Sockets for ICs, Transistors

126-91-624-41-003000

part stock: 44

126-41-424-41-003000

part stock: 32

126-91-324-41-003000

part stock: 94

126-41-324-41-003000

part stock: 40

121-13-642-41-001000

part stock: 4556

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

111-93-324-61-001000

part stock: 29

124-43-432-41-002000

part stock: 91

124-93-632-41-002000

part stock: 4549

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

124-43-632-41-002000

part stock: 51

116-91-642-41-008000

part stock: 34

124-93-432-41-002000

part stock: 4477

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-41-642-41-008000

part stock: 40

126-41-640-41-002000

part stock: 124

126-91-640-41-002000

part stock: 57

110-93-322-41-105000

part stock: 4507

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-314-41-006000

part stock: 4690

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

114-91-964-41-117000

part stock: 112

114-41-964-41-117000

part stock: 86

110-13-648-41-001000

part stock: 4526

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-11-642-41-770000

part stock: 52

110-91-964-41-105000

part stock: 44

110-41-964-41-105000

part stock: 39

126-93-424-41-002000

part stock: 4529

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-93-624-41-002000

part stock: 4523

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-93-324-41-002000

part stock: 4507

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-424-41-002000

part stock: 31

116-91-648-41-003000

part stock: 124

126-43-324-41-002000

part stock: 94

116-41-648-41-003000

part stock: 106

126-43-624-41-002000

part stock: 82

104-11-950-41-780000

part stock: 41

110-93-328-61-001000

part stock: 124

111-43-952-41-001000

part stock: 67

110-43-328-61-001000

part stock: 48

111-93-952-41-001000

part stock: 4561

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-93-628-61-001000

part stock: 88