Sockets for ICs, Transistors

126-91-652-41-002000

part stock: 115

124-41-950-41-002000

part stock: 65

124-91-950-41-002000

part stock: 34

124-41-650-41-002000

part stock: 81

124-91-650-41-002000

part stock: 28

123-11-648-41-001000

part stock: 55

110-44-306-61-001000

part stock: 45

127-43-656-41-002000

part stock: 38

127-93-656-41-002000

part stock: 72

127-41-656-41-003000

part stock: 40

127-91-656-41-003000

part stock: 91

122-13-648-41-001000

part stock: 4062

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-652-41-001000

part stock: 49

126-43-952-41-001000

part stock: 51

127-91-664-41-002000

part stock: 48

127-41-664-41-002000

part stock: 70

127-91-764-41-002000

part stock: 33

126-93-952-41-001000

part stock: 4045

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

127-41-764-41-002000

part stock: 74

126-93-652-41-001000

part stock: 4050

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-43-952-41-001000

part stock: 113

123-93-952-41-001000

part stock: 4047

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-964-41-007000

part stock: 64

116-93-964-41-007000

part stock: 4042

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-41-964-41-001000

part stock: 31

126-91-650-41-002000

part stock: 47

126-91-950-41-002000

part stock: 29

126-41-950-41-002000

part stock: 38

126-41-650-41-002000

part stock: 91

126-93-640-41-003000

part stock: 4067

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-640-41-003000

part stock: 113

123-13-642-41-001000

part stock: 4073

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

121-11-952-41-001000

part stock: 101

121-13-652-41-001000

part stock: 4136

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-13-628-41-801000

part stock: 4086

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

117-41-668-41-105000

part stock: 58