Proto Board Type: SMD to DIP, Package Accepted: QFN, QFN, Number of Positions: 32, Pitch: 0.031" (0.80mm),
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 32, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: TSOP, Number of Positions: 32, Pitch: 0.020" (0.50mm),
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 28, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 32, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 40, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 18, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: QSOP, Number of Positions: 20, Pitch: 0.025" (0.64mm),
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 18, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: QFP, Number of Positions: 44,
Proto Board Type: SMD to DIP, Package Accepted: QSOP, Number of Positions: 16, Pitch: 0.025" (0.64mm),
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 24, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 8, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 6, Pitch: 0.037" (0.95mm),
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: MSOP, Number of Positions: 10, Pitch: 0.020" (0.50mm),
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 14, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 16, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: MSOP, Number of Positions: 8, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 24, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 20, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 14, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
