Type: Top Mount, Package Cooled: D²Pak (TO-263), SOL-20, SOT-223, TO-220, Attachment Method: SMD Pad, Shape: Rectangular, Fins, Length: 0.740" (18.80mm), Width: 0.600" (15.24mm),
Type: Top Mount, Package Cooled: Power Modules, Attachment Method: Press Fit, Shape: Rectangular, Fins, Length: 4.724" (120.00mm), Width: 4.921" (124.99mm),
Type: Top Mount, Package Cooled: Power Modules, Attachment Method: Press Fit, Shape: Rectangular, Fins, Length: 7.087" (180.01mm), Width: 4.921" (124.99mm),
Type: Top Mount, Package Cooled: Power Modules, Attachment Method: Press Fit, Shape: Rectangular, Fins, Length: 11.811" (300.00mm), Width: 4.921" (124.99mm),
Type: Board Level, Package Cooled: TO-5, Attachment Method: Press Fit, Shape: Cylindrical,
Type: Top Mount, Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Shape: Square, Fins, Length: 0.985" (25.02mm), Width: 0.985" (25.02mm),
Type: Top Mount, Package Cooled: BGA, Attachment Method: Push Pin, Shape: Rectangular, Fins, Length: 1.480" (37.59mm), Width: 1.516" (38.50mm),
Type: Top Mount, Package Cooled: BGA, Attachment Method: Push Pin, Shape: Square, Fins, Length: 2.362" (60.00mm), Width: 2.362" (60.00mm),
Type: Top Mount, Package Cooled: TO-5, Attachment Method: Threaded Coupling, Shape: Cylindrical,
Type: Top Mount, Package Cooled: TO-5, Attachment Method: Press Fit, Shape: Cylindrical,
