Package Cooled: BGA, Attachment Method: Clip, Shape: Cylindrical,
Type: Top Mount, Extrusion, Package Cooled: Power Modules, Attachment Method: Adhesive, Shape: Rectangular, Fins, Length: 12.000" (304.80mm), Width: 11.000" (279.40mm),
Type: Top Mount, Extrusion, Package Cooled: Power Modules, Attachment Method: Adhesive, Shape: Rectangular, Fins, Length: 12.320" (312.93mm), Width: 3.420" (86.87mm),
Type: Board Level, Package Cooled: TO-5, Attachment Method: Press Fit, Shape: Cylindrical, Length: 0.400" (10.16mm), Width: 0.315" (8.00mm) ID,