Type: DIP, .300", Number of Positions or Pins (Grid): 8 (2 x 4), Contact Material: Copper Alloy,
Type: SOIC, 0.30" Body, Number of Positions or Pins (Grid): 28 (2 x 14), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: SOIC, 0.15" Body, Number of Positions or Pins (Grid): 8 (2 x 4), Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 8 (2 x 4), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 16 (2 x 8), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 20 (2 x 10), Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 16 (2 x 8), Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 14 (2 x 7), Contact Finish: Gold, Contact Material: Copper Alloy,
Type: DIP, .300", Number of Positions or Pins (Grid): 14 (2 x 7), Contact Material: Copper Alloy,
Type: SOIC, 0.15" Body, Number of Positions or Pins (Grid): 8 (2 x 4), Contact Finish: Gold, Contact Material: Copper Alloy,
