Kit Type: Adapter, Breakout Boards, Quantity: 5 Pieces (5 Values - 1 Each), Specifications: SMD to DIP,
Kit Type: Prototyping Bundle, Quantity: 28 Pieces, Specifications: Assorted End Mills, Assorted Materials, PCB Blanks,
Kit Type: Prototyping Bundle, Quantity: 40 Pieces, Specifications: Assorted End Mills, Assorted Materials, PCB Blanks,
Kit Type: Prototyping Bundle, Quantity: 56 Pieces, Specifications: Assorted End Mills, PCB Blanks,
Kit Type: Adapter, Breakout Boards, Quantity: 52 Pieces (26 Values - 2 Each), Specifications: SMD to SIP,
Kit Type: Adapter, Breakout Boards, Quantity: 32 Pieces (10 Values - Mixed Quantities), Specifications: SMD to SIP,
Kit Type: Adapter, Breakout Boards, Quantity: 46 Pieces (23 Values - 2 Each), Specifications: SMD to SIP,
Kit Type: PCB Machining Kit, Quantity: 64 Pieces (Assorted Per Value), Specifications: Assorted End Mills, PCB Blanks,
Kit Type: Adapter, Breakout Boards, Quantity: 18 Pieces (3 Values - 6 Each), Package Accepted: HTSSOP, VFBGA, XFBGA, Specifications: SMD to DIP, Number of Positions: 24,
Kit Type: Adapter, Breakout Boards, Quantity: 42 Pieces (5 Values - Mixed Quantities), Package Accepted: HWSON, MSOP, SO, VSSOP, XQFN, Specifications: SMD to DIP, Number of Positions: 8,
Kit Type: Adapter, Breakout Boards, Quantity: 24 Pieces (4 Values - 6 Each), Package Accepted: DHVQFN, Specifications: SMD to DIP, Number of Positions: 14, 16, 20, 24,
Kit Type: Adapter, Breakout Boards, Quantity: 24 Pieces (4 Values - 6 Each), Package Accepted: TSSOP, Specifications: SMD to DIP, Number of Positions: 14, 16, 20, 24,
Kit Type: Adapter, Breakout Boards, Quantity: 42 Pieces (7 Values - 6 Each), Package Accepted: HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP, Specifications: SMD to DIP, Number of Positions: 6, 8, 10,
Kit Type: Adapter, Breakout Boards, Quantity: 23 Pieces (4 Values - Mixed Quantities), Package Accepted: QSOP, TSSOP28, XFBGA, XQFN, Specifications: SMD to DIP, Number of Positions: 16, 28,
Kit Type: Adapter, Breakout Boards, Quantity: 24 Pieces (4 Values - 6 Each), Package Accepted: HVQFN, Specifications: SMD to DIP, Number of Positions: 16, 20, 24,
